MODELING THE COEFFICIENT OF RESISTANCE TO THE MOVEMENT OF METAL CHIPS

Abstract

The article presents theoretical and practical studies aimed at establishing the patterns of changes in the coefficient of resistance to chip movement in the area of possible changes in the parameters of the system of complex use of the lubricating and cooling technological environment. When conducting experimental studies, the varying parameters changed in the ranges: roughness parameter Rz = 1…500 μm (Rz = 1, 25, 100, 300, 500); pressure in the volume of accumulated chips p = 0.00275…0.00975 MPa (p = 0.00275, 0.0055, 0.0075, 0.00975); humidity changed at two levels (excessive presence and complete absence of water). The results of the studies showed that the greatest influence is exerted by the variation of the roughness parameter (an increase in the coefficient of resistance to chip movement by approximately 3 times). Wetting also has a significant effect (an increase in the resistance coefficient to chip movement by 2-3 times). The smallest effect of the considered parameters is exerted by the change in pressure in the moving volume of chips (a decrease in the resistance coefficient to chip movement by approximately 1.8 times). The maximum change in the resistance coefficient to chip movement within the studied range of parameter variation is from 0.23 to 1.36, which represents approximately a sixfold increase. Based on the results of experimental studies, regression models of the change in the resistance coefficient to metal chip movement have been developed, which qualitatively correspond well with the known laws of the change in the kinematic coefficient of metal-on-metal friction in tribotechnics and adequately establish the corresponding quantitative ratios in the studied range of possible changes in the parameters of the force effect system of the lubricating and cooling technological environment. The obtained models can be used to solve a wide range of problems related to the optimal design of systems for the complex use of the lubricating and cooling technological environment.