DISCHARGE CHARACTERISTICS OF THE MAGNETRON SYSTEM FOR SPUTTERING, DEPOSITION, AND NANOTECHNOLOGY APPLICATIONS

Andrii Breus, Oleksii Serdiuk, Vasyl Ruzaikin, Oleg Baranov

Abstract


Magnetron sputtering is known for years as a powerful tool for coating deposition of cutting tools and machine parts. However the experimental measurements of the magnetron discharge parameters are still necessary to provide a consumer of the magnetron system with the reliable characteristics. A voltage-current relation is the most applied characteristic of the discharge, and it is described as the power low of a type U = U0 + aIn, where U and I are the voltage drop and the discharge current, respectively, and U0 and n are constant. First part of the research is dedicated to the experiments conducted in the magnetron setup provided with the titanium cathode in a vacuum chamber filled with argon or argon-nitrogen mixture, and the constants are determined for the particular geometry of the magnetron sputtering system. The obtained results can be used to choose the operation modes for the traditional applications of the magnetron discharge such as ion cleaning and heating of the non-magnetic workpieces arranged on the cathode, as well as for the sputtering deposition of the titanium and titanium nitride coatings on the surfaces of the workpieces located above the magnetron cathode. In the next part of the research the novel application of the magnetron for production of carbon nanostructures is considered. For the purpose, a layer of expanded graphite is arranged on the magnetron cathode, and the discharge is initiated in oxygen atmosphere. It was found that for the time interval of a few hours the discharge is described as a superposition of the typical magnetron glow with arc spot generation, and the intensity of the arcs is not decreased with time. At that, the arc initiation was accompanied with the formation of clusters of the graphite cathode. The process is explained in terms of the cathode spot generation at the interaction of the arc plasma with the non-melting material. This process can be beneficial for the development of the plasma reactors for the large-scale production of the carbon species at the low gas pressures suitable for the magnetron discharge operation. Thus, the magnetron sputtering systems provided with the expanded graphite cathode can be considered as the tool to grow carbon nanospecies in the arc discharge cathode spots.

Keywords


plasma; magnetron discharge; voltage-current relations; nanotechnology; carbon nanoparticles

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References


Anders, A. Tutorial: Reactive high power impulse magnetron sputtering (R-HiPIMS). Journal of Applied Physics, 2017, vol. 121, no. 17, pp. 171101-1-171101-34. DOI: 10.1063/1.4978350.

Baranov, O., Bazaka, K., Kersten, H., Keida, M., Cvelbar, U., Xu, S., Levchenko, I. Plasma under control: Advanced solutions and perspectives for plasma flux management in material treatment and nanosynthesis. Applied Physics Reviews, 2017, vol. 4, no. 4, pp. 041302-1-041302-33. DOI: 10.1063/1.5007869.

Baranov, O., Romanov, M., Kumar, S., Zhong, X., Ostrikov, K. Magnetic control of breakdown: Toward energy-efficient hollow-cathode magnetron discharges. Journal of applied physics, 2011, v. 109, no. 6, pp. 063304-1-063304-8. DOI: 10.1063/1.3553853.

Bleykher, G. A., Borduleva, A. O., Krivobokov, V. P., Sidelev, D. V. Evaporation factor in productivity increase of hot target magnetron sputtering systems. Vacuum, 2016, no. 132, pp. 62-69. DOI: 10.1016/j.vacuum.2016.07.030.

Trieschmann, J., Ries, S., Bibinov, N., Awakowicz, P., Mráz, S., Schneider, J. M., Mussenbrock, T. Combined experimental and theoretical description of direct current magnetron sputtering of Al by Ar and Ar/N2 plasma. Plasma Sources Science and Technology, 2018, v. 27, no. 5, pp. 054003-1-054003-10. DOI: 10.1088/1361-6595/aac23e.

Shapovalov, V. I., Karzin, V. V., Bondarenko, A. S. Physicochemical model for reactive sputtering of hot target. Physics Letters A, 2017, v. 381, no. 5, pp. 472-475. DOI: 10.1016/j.physleta.2016.11.028.

Kelly, P. J., Arnell, R. D. Magnetron Sputtering: A Review of Recent Developments and Applications. Vacuum, 2000, no. 56, pp. 159-172. DOI: 10.1016/S0042-207X(99)00189-X.

Viloan, R. P. B., Gu, J., Boyd, R., Keraudy, J., Li, L., Helmersson U. Bipolar high power impulse magnetron sputtering for energetic ion-bombardment during TiN thin film growth without the use of a substrate bias. Thin Solid Films, 2019, no. 688, pp. 137350-1-137350-6. DOI: 10.1016/j.tsf.2019.05.069.

Baranov, O., Romanov, M., Wolter, M., Kumar, S., Zhong, X., Ostrikov, K. Low-pressure planar magnetron discharge for surface deposition and nanofabrication, Physics of plasmas, 2010, no 17, pp. 053509-1-053509-9. DOI: 10.1063/1.3431098.

Conrads, H. Schmidt, M. Plasma generation and plasma sources. Plasma sources science and technology, 2000, no. 9, pp. 441-454. DOI: 10.1088/0963-0252/9/4/301.

Keidar, M. Boyd, I. D., Beilis, I. I. Modeling of a high-power thruster with anode layer. Physics of plasmas, no. 11, 2004, pp. 1715-1722. DOI: 10.1063/1.1668642.

Lieberman, M. A., Lichtenberg A. J. Principles of plasma discharges for materials processing, Wiley Interscience, 2005. 572 p.

Bradley, J. W. Study of the plasma pre-sheath in magnetron discharges dominated by Bohm diffusion of electrons. Plasma sources science and technology, 1998, no. 7, pp. 572-580. DOI: 10.1088/0963-0252/7/4/014.

Morozov, A. I., Savelyev, V. V. Fundamentals of stationary plasma thruster theory. Review of Plasma Physics, Consultant Bureau, 2000. 203 p. DOI: 10.1007/978-1-4615-4309-1_2.

Maurya, D. Sardarinejad, A., Alameh, K. Recent developments in r.f. magnetron sputtered thin films for pH sensing applications – an overview. Coatings, 2014, vol. 4, no. 4, pp. 756-771. DOI: 10.3390/coatings4040756.

Gudmundsson, J. T., Brenning, N., Lundin, D., Helmersson, U. High power impulse magnetron sputtering discharge. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 2012, v. 30, no. 3, pp. 030801-1-030801-34. DOI: 10.1116/1.3691832.

Kolev, I., Bogaerts, A., Gijbels, R. Influence of electron recapture by the cathode upon the discharge characteristics in dc planar magnetrons. Physical review E, 2005, no. 72, pp. 056402-1-056402-11. DOI: 10.1103/PhysRevE.72.056402.

Costin, C., Popa, G., Gousset, G. On the secondary electron emission in dc magnetron discharge. Journal of optoelectronics and advanced materials, 2005, v. 7, no. 5, pp. 2465-2469.

Bogaerts, A., Bultinck, E., Kolev, I., Schwaederl, L., Van Aeken, K., Buyle, G., Depla D. Computer modeling of magnetron discharges. Journal of physics D: applied physics, 2009, no. 42, pp. 194018-1-194018-12. DOI: 10.1088/0022-3727/42/19/194018.

Corbella, C., Portal, S., Rao, J., Kundrapu, M. N., Keidar, M. Tracking nanoparticle growth in pulsed carbon arc discharge. Journal of Applied Physics, 2020, v. 127, no 24, pp. 243301-1-243301-16. DOI: 10.1063/5.001128.

Baranov, O., Levchenko, I., Xu, S., Lim, J. W. M., Cvelbar, U., Bazaka, K. Formation of vertically oriented graphenes: what are the key drivers of growth? 2D Materials, 2018, v. 5, no. 4, pp.044002-1-044002-12. DOI: 10.1088/2053-1583/aad2bc.




DOI: https://doi.org/10.32620/aktt.2020.6.08